3D-Micromac Signs MOU with dpiX to Formalize Partnership for Flat Panel Sensor Manufacturing


4 May, 2021 dpiX and 3D-Micromac America today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing of laser-manufactured flat panel sensor semiconductors.

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Anu Bhambhani is the Senior News Editor of TaiyangNews. Anu is our solar news whirlwind. At TaiyangNews she covers everything that is of importance in the world of solar power. --Email: [email protected]

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